Postek (HK) Co., Limited | HSI2 Series

HSI2 High-Speed Micro-Rectangular Electrical Connector

Name: HK-HSI2
Brand: Postek (HK) Co., Limited
SKU: HK-HSI2

3.125 Gbps+ · 1.27 mm Pitch · 20–120 Positions · Board-to-Board 6–15 mm

Data Rate 3.125 Gbps+ Differential Crosstalk ≤5% Metal Shell Reinforced -55°C to +125°C

📄 Download Datasheet 📦 Request Quote

HSI2 High-Speed Micro-Rectangular Connector

HSI2 Series Board-to-Board Interconnect System

1. Product Overview

✅ Source Verified — Technical data verified against official supplier datasheet HK-HSI2.pdf. All parameters traceable to source document.

The HSI2 Series is a high-speed micro-rectangular electrical connector designed for demanding flight systems, high-altitude platforms, and high-reliability industrial applications requiring dense, high-integrity signal interconnect. With a low-profile board-to-board stacking height from 6 mm to 15 mm and a 1.27 mm contact pitch, the HSI2 delivers data rates of 3.125 Gbps+ for mezzanine board high-speed signal interconnection in radar, computer, and control systems. The connector features a reinforced metal shell and twisted-wire elastomeric pin contacts for stable, reliable contact performance under vibration and shock.

Data Rate 3.125 Gbps+

Characteristic Impedance 100 ±15 Ω

Contact Spacing 1.27 mm

Positions 20 – 120

Board-to-Board Height 6 – 15 mm

Rated Current 1 A

Key Features

Low-profile board-to-board stacking — heights from 6 mm to 15 mm

High-speed data transmission at 3.125 Gbps+ for mezzanine board interconnect

1.27 mm contact spacing for high contact density and reduced weight

Metal shell reinforcement with twisted-wire elastomeric pin contacts for vibration and shock resistance

Available in 13 contact arrangements: 20, 30, 40, 50, 60, 64, 70, 80, 84, 90, 100, 110, 120 positions

Multiple termination styles: straight PCB through-hole and vertical surface-mount

Optional guide and locking accessories for secure PCB attachment

2. Technical Specifications

2.1 Electrical Specifications 📄 Datasheet

Parameter	Value
Characteristic Impedance	100 ±15 Ω
Data Rate	3.125 Gbps+
Rated Current	1 A
Dielectric Withstanding Voltage	500 V
Insulation Resistance	≥1000 MΩ (500 VDC)
Contact Resistance	≤30 mΩ
Differential Crosstalk	≤5% (@3.125 Gbps)

2.2 Mechanical Specifications 📄 Datasheet

Parameter	Value
Mechanical Life	500 cycles
Contact Spacing	1.27 mm
Board-to-Board Height	6, 7, 8, 9, 10, 11, 12, 13, 14, 15 mm
Contact Arrangements	20, 30, 40, 50, 60, 64, 70, 80, 84, 90, 100, 110, 120 positions
Termination Style	Straight PCB through-hole (Code 1); Vertical surface-mount (Code 3)
Mating Guidance	Max 0.3 mm guidance along width and length directions

2.3 Environmental Specifications 📄 Datasheet

Parameter	Value
Operating Temperature	-55°C to +125°C
Storage Temperature	-10°C to +40°C
Storage Humidity	≤75% RH
Sinusoidal Vibration	10 Hz – 2000 Hz, 196 m/s²
Random Vibration	10 Hz – 2000 Hz, 0.4 G²/Hz
Shock	735 m/s²
Salt Spray	48 h (Aluminum Alloy Shell); 96 h (Stainless Steel Shell)

3. Part Number Nomenclature

HSI2 – n TJ/ZK H 1/3 – 01/02/03 L – G

Position	Code	Description
Series	HSI2	High-Speed Micro-Rectangular Connector Series
Contact Number	n	20, 30, 40, 50, 60, 64, 70, 80, 84, 90, 100, 110, 120
Connector & Contact Type	TJ / ZK	TJ — Plug with pin contacts; ZK — Receptacle with socket contacts (fixed pairing)
Board-to-Board Height	M, N, A, B, C, D, E, F, G, H	M=6mm, N=7mm, A=8mm, B=9mm, C=10mm, D=11mm, E=12mm, F=13mm, G=14mm, H=15mm
Termination Style	1 / 3	1 — Straight PCB through-hole; 3 — Vertical surface-mount
Design Variant	01 / 02 / 03	01 — No guide hardware (shell not lockable to PCB); 02 — With mating guide hardware (shell lockable to PCB); 03 — With mating locking hardware (shell lockable to PCB)
Pin Extension / PCB Thickness	A, B, C, D, E, F, G	A=2.1mm (PCB 1.4–1.6mm); B=2.6mm (PCB 1.7–2.1mm); C=3.1mm (PCB 2.2–2.6mm); D=3.6mm (PCB 2.7–3.1mm); E=4.1mm (PCB 3.2–3.6mm); F=4.6mm (PCB 3.7–4.1mm); G=5.1mm (PCB 4.2–4.6mm)
Shell Material	(blank) / G	Blank — Aluminum Alloy; G — Stainless Steel

4. Contact Arrangements

Positions	Layout
20	A1–A10, B1–B10
30	A1–A15, B1–B15
40	A1–A20, B1–B20
50	A1–A25, B1–B25
60	A1–A30, B1–B30
64	A1–A32, B1–B32
70	A1–A35, B1–B35
80	A1–A40, B1–B40
84	A1–A42, B1–B42
90	A1–A45, B1–B45
100	A1–A50, B1–B50
110	A1–A55, B1–B55
120	A1–A60, B1–B60

5. Installation Notes

Maximum guidance distance for plug and receptacle along width and length directions is 0.3 mm.

Align plug and receptacle to the mating interface; apply insertion force perpendicular to the mating face.

No locking mechanism between plug and receptacle — parallel boards must incorporate support pillars and locking devices.

6. Certifications & Compliance

Environmental -55°C to +125°C Operating, Salt Spray 48h / 96h per Shell Material

Vibration & Shock Sinusoidal 196 m/s², Random 0.4 G²/Hz, Shock 735 m/s²

High-Reliability Twisted-wire elastomeric contacts, metal shell reinforcement

7. Frequently Asked Questions

What data rate does the HSI2 support?

The HSI2 series supports data rates of 3.125 Gbps+ with differential crosstalk ≤5% at 3.125 Gbps.

What board-to-board heights are available?

Ten stacking heights are available: 6, 7, 8, 9, 10, 11, 12, 13, 14, and 15 mm, designated by codes M through H.

Is a locking mechanism included?

Design variant 01 has no guide or locking hardware. Variant 02 includes mating guide hardware, and variant 03 includes mating locking hardware — both allow the shell to be secured to the PCB.

What shell materials are offered?

Aluminum alloy (standard, 48h salt spray) and stainless steel (code G, 96h salt spray).

8. Dimensional Drawings

HSI2-nTJ-1-01 Outline Drawing — HSI2-nTJ□1-01□-□ Plug, Straight PCB, No Guide — Outline Dimensions

HSI2-nTJ-1-01 PCB Footprint — HSI2-nTJ□1-01□-□ Plug, Straight PCB — PCB Hole Pattern

HSI2-nTJ-3-01 Outline Drawing — HSI2-nTJ□3-01-□ Plug, Surface-Mount, No Guide — Outline Dimensions

HSI2-nTJ-3-01 PCB Footprint — HSI2-nTJ□3-01-□ Plug, Surface-Mount — PCB Pad Pattern

HSI2-nZK-1-01 Outline Drawing — HSI2-nZK□1-01□-□ Receptacle, Straight PCB, No Guide — Outline Dimensions

HSI2-nZK-1-01 PCB Footprint — HSI2-nZK□1-01□-□ Receptacle, Straight PCB — PCB Hole Pattern

HSI2-nZK-3-01 Outline Drawing — HSI2-nZK□3-01-□ Receptacle, Surface-Mount, No Guide — Outline Dimensions

HSI2-nZK-3-01 PCB Footprint — HSI2-nZK□3-01-□ Receptacle, Surface-Mount — PCB Pad Pattern

HSI2 Installation Diagram — Product Installation Diagram — Board-to-Board Stacking Heights (M–H)

HSI2-nTJ-1-02 Outline Drawing — HSI2-nTJ□1-02□-□ Plug, Straight PCB, With Guide — Outline Dimensions

HSI2-nTJ-1-03 Outline Drawing — HSI2-nTJ□1-03□-□ Plug, Straight PCB, With Locking — Outline Dimensions

HSI2-nZK-1-03 Outline Drawing — HSI2-nZK□1-03□-□ Receptacle, Straight PCB, With Locking — Outline Dimensions

9. Resources

📄 Download Full Datasheet (PDF)

Complete technical specifications, dimensional drawings, and ordering information.

📚 Related Technical Articles

EMI/RFI Shielding in Connectors — Understanding shielding effectiveness in high-speed interconnect systems.
Vibration & Contact Failure — How twisted-wire elastomeric contacts mitigate fretting and intermittency under dynamic loads.
Temperature Performance — Material and design considerations for reliable operation from -55°C to +125°C.

HK-HSI2 — High-Speed Micro-Rectangular Electrical Connector