Postek (HK) Co., Limited | HK Series
KWQMY2-3AT11-1 Miniature Hermetically Sealed Micro Switch
SPDT Changeover · EMI Shielded · 28V DC 1A · GJB 809B-2013
Hermetic ≤1×10⁻³ Pa·cm³/s
EMI Shielded
Radiation Hardened
GJB 809B-2013
Outline Dimensions (mm)
1. Product Overview
✅ Source Verified — GJB 809B-2013 / GJB 360B-2009 compliant.
Miniature hermetically sealed snap-action micro switch. SPDT changeover. EMI shielded metal shell. Radiation hardened. 28V DC 1A resistive, 0.5A inductive. Seal leak rate ≤ 1×10⁻³ Pa·cm³/s.
Rated Load28V DC 1A / 0.5A
Contact Resistance≤ 120 mΩ
Contact Bounce≤ 5 ms
Vibration10~2000Hz, 15g
Shock50 g
Salt Spray96 hours
Key Features
Hermetically sealed — leak rate ≤ 1×10⁻³ Pa·cm³/s
SPDT changeover circuit configuration
EMI shielded metal shell
Radiation hardened
Snap-action mechanism for long life
Miniature form factor
2. Specifications
Electrical
| Parameter | Value |
|---|---|
| Rated Load (Resistive) | 28V DC, 1A |
| Rated Load (Inductive) | 28V DC, 0.5A |
| Contact Resistance | ≤ 120 mΩ |
| Contact Bounce | ≤ 5 ms |
| Leakage Rate | ≤ 1×10⁻³ Pa·cm³/s |
Environmental
| Parameter | Value |
|---|---|
| Vibration | 10~2000 Hz, 15 g |
| Shock | 50 g |
| Damp Heat | 10 days |
| Salt Spray | 96 hours |
| Low Pressure | 4.4 kPa |
3. Drawings
4. Ordering
📄 Datasheet
Download PDF📦 Quote
5. Related
📚 Related Technical Articles
- EMI/RFI Shielding in Hermetic Switches → — Integrated Faraday cage design, >50dB @ 1GHz
- How to Select Switches for Extreme Temperatures → — Combined EMI + thermal protection
- How to Prevent Contact Failure Under High Vibration → — Mechanical robustness for shielded switches