Postek (HK) Co., Limited  |  HSI Series

HSI Surface-Mount High-Speed Transmission Micro-Rectangular Connector

3.125 Gbps+  ·  20–120 Contacts  ·  6–15 mm Board-to-Board  ·  -55°C to +125°C

Data Rate 3.125 Gbps+ Differential Crosstalk ≤5% Metal Shell Reinforced Surface Mount
HSI Series High-Speed Connector

HSI Series Surface-Mount High-Speed Micro-Rectangular Connector

1. Product Overview

Source Verified — Technical data verified against official supplier datasheet HK-HSI.pdf. All parameters traceable to source document.

The HSI Series is a surface-mount high-speed transmission micro-rectangular connector designed for demanding inter-shelf signal interconnections in high-reliability flight systems, radar platforms, and control computers. With a low-profile board-to-board height ranging from 6 mm to 15 mm and a data rate exceeding 3.125 Gbps, it is optimized for high-density, space-constrained applications requiring robust signal integrity. The connector features a reinforced metal shell and twisted-wire elastic contacts for stable, vibration-resistant performance.

Data Rate 3.125 Gbps+
Characteristic Impedance 100±15 Ω
Rated Current 1 A
Temperature Range -55°C to +125°C
Contact Count 20 to 120
Board-to-Board Height 6 to 15 mm

Key Features

High-speed data transmission capability exceeding 3.125 Gbps
Low differential crosstalk ≤ 5% at 3.125 Gbps for superior signal integrity
Reinforced metal shell with twisted-wire elastic contacts for high vibration and shock resistance
Ultra-low profile board-to-board heights from 6 mm to 15 mm
Surface-mount termination with 1 mm pad pitch for high-density PCB layouts
Wide contact range: 20, 30, 40, 50, 60, 64, 70, 80, 84, 90, 100, 110, 120 positions
Stainless steel or aluminum alloy shell options for environmental protection

2. Technical Specifications

2.1 Electrical Specifications 📄 Datasheet

ParameterValue
Characteristic Impedance100±15 Ω
Data Rate3.125 Gbps+
Rated Current1 A
Dielectric Withstanding Voltage500 V
Insulation Resistance≥ 1000 MΩ (500 VDC)
Contact Resistance≤ 30 mΩ
Differential Crosstalk≤ 5% (@ 3.125 Gbps)

2.2 Mechanical & Environmental Specifications 📄 Datasheet

ParameterValue
Mechanical Life500 cycles
Sinusoidal Vibration10 Hz ~ 2000 Hz, 196 m/s²
Random Vibration10 Hz ~ 2000 Hz, 0.4 G²/Hz
Shock735 m/s², 11 ms
Operating Temperature-55°C to +125°C
Salt Spray48 h (Aluminum Alloy Shell), 96 h (Stainless Steel Shell)
Storage ConditionsTemperature: -10°C to +40°C; Humidity: ≤ 75% RH

Abbreviation Glossary

Gbps
Gigabits per second — unit of data transfer rate.
Characteristic Impedance
The impedance of a transmission line that determines signal reflection behavior.
Differential Crosstalk
Unwanted signal coupling between differential pairs, expressed as a percentage.
Dielectric Withstanding Voltage
Maximum voltage the insulator can withstand without breakdown.

3. Part Number Nomenclature

Example: HSI-60ZKJ0-01

HSI — Series Designator

60 — Number of Contacts (20, 30, 40, 50, 60, 64, 70, 80, 84, 90, 100, 110, 120)

ZK — Connector & Contact Type (TJ: Plug with Pin; ZK: Receptacle with Socket)

J — Board-to-Board Height Code (J: 6mm, A: 7mm, B: 8mm, C: 9mm, D: 10mm, E: 11mm, F: 12mm, G: 13mm, H: 14mm, I: 15mm)

0 — Gold Plating Thickness (0: 1.27μm, 1: 0.76μm, 2: 0.38μm)

01 — Design Sequence Number

Nomenclature Table

PositionParameterCode / Options
1SeriesHSI
2Contact Count20, 30, 40, 50, 60, 64, 70, 80, 84, 90, 100, 110, 120
3Connector TypeTJ (Plug with Pin), ZK (Receptacle with Socket)
4Board-to-Board HeightJ (6mm), A (7mm), B (8mm), C (9mm), D (10mm), E (11mm), F (12mm), G (13mm), H (14mm), I (15mm)
5Gold Plating Thickness0 (1.27μm), 1 (0.76μm), 2 (0.38μm)
6Locking ComponentNone (Default), P (P-Type Locking)
7Design Sequence01, 02, 03…
8Shell MaterialNone (Aluminum Alloy), G (Stainless Steel)

4. Contact Arrangements

Contact CountRow ARow B
20A1 – A10B1 – B10
30A1 – A15B1 – B15
40A1 – A20B1 – B20
50A1 – A25B1 – B25
60A1 – A30B1 – B30
64A1 – A32B1 – B32
70A1 – A35B1 – B35
80A1 – A40B1 – B40
84A1 – A42B1 – B42
90A1 – A45B1 – B45
100A1 – A50B1 – B50
110A1 – A55B1 – B55
120A1 – A60B1 – B60

5. Dimensional Drawings & PCB Layouts

6. Applications & Compliance

6.1 Typical Applications

High-speed inter-shelf signal interconnection in airborne radar systems
Control computers and processing units in high-altitude platforms
High-reliability data links in flight systems
Dense PCB-to-PCB connections where space and weight are critical

6.2 Certifications & Standards

Salt Spray Resistance 48 h (Aluminum) / 96 h (Stainless Steel)
Vibration Profile Sinusoidal 10–2000 Hz, 196 m/s²
Shock Rating 735 m/s², 11 ms
Operating Temp -55°C to +125°C

7. Frequently Asked Questions

What data rate does the HSI series support?

The HSI series supports data rates exceeding 3.125 Gbps, making it suitable for high-speed digital signal transmission in demanding environments.

What board-to-board heights are available?

Ten standard heights are available: 6, 7, 8, 9, 10, 11, 12, 13, 14, and 15 mm. The height is specified by a letter code in the part number (J through I).

How many contact positions can I get?

The series offers 13 standard contact counts: 20, 30, 40, 50, 60, 64, 70, 80, 84, 90, 100, 110, and 120 positions.

What is the difference between TJ and ZK connector types?

TJ designates a plug connector with pin contacts, while ZK designates a receptacle connector with socket contacts. They are a fixed mating pair.

Are locking components available?

By default, the connector has no locking components. A P-type locking component is available as an option. For parallel board applications, external support pillars and locking devices are recommended.